Direct-bond Copper (DBCu) Substrates from Stellar Industries

Globec > Hybrids > Substrates

Available in the UK through Globec, Direct-Bond Copper substrates fabricated in the USA by Stellar Industries.

Direct-bond copper technology offers advantages over traditional thin or thick film technologies in high power, high current and high temperature applications. Standard substrate materials are Aluminium Nitride (AlN) and Beryllium Oxide (BeO).

Typical substrates thickness is .015” [381mm], .020” [508mm], .025” [635mm] or .040” [1.02mm]. Substrate sizes up to 4” x 4” [100mm x 100mm] can be machined and metalised according to customer’s specific requirements.

Key Features

• OFHC Copper foil : 0.005” – 0.012” [127µm – 0.3µm]
• High thermal and electrical conductivity
• Excellent substrate adhesion
• Suitable for high power, high current and high temperature applications
• Economical

Applications

Thin and thick film microelectronics, Science research and Space electronics, Hybrid Power Systems (commercial, industrial, automotive & military).

Other products and services from Stellar Industries

• Sub-Mounts – for laser diodes and detectors
• AuSn Vapour Deposition – for increased yields & reliability and reduced costs
• Heat Spreaders – for high temperature, high current or high power applications