Thick Film Hybrid Microcircuits from Beru Microelectronica

Globec > Hybrids > Hybrid Circuits

As the authorised UK technical agent and distributor, Globec supplies thick film hybrid microcircuits designed and manufactured in Spain by BERU Microelectronica

BERU Microelectronica is a highly qualified Thick Film hybrid manufacturing facility and fast becoming one of Europe’s premier manufacturers of high-volume, low-cost hybrid circuits for a wide variety of applications.

BERU uses the most advanced automated technology and processes to deliver reliable, high-quality products. The manufacturing plant is approved to internationally recognised quality standards including ISO9001; MIL-R-83401; MIL-STD 202; MIL-STD 883.

Key Capabilities

• Thick Film Technology – conductors, resistors, capacitors and inductors produced directly onto the substrate, using screen-printing processes.
• SMD Technology – highly automated assembly of descrete, active and passive components
• Chip & Wire Technology – bonding of raw die to the substrate using wire bonding techniques suitable for use in hermetically sealed packages.
• Chip-on-Board (CoB) Technology – the art of epoxy sealing raw die onto an open substrates (PCB or Alumina) to protect against the effects of shock and light.
• MultiChip Modules – the technology of building up electronic modules which using multiple chips as the building blocks

Applications

Telecommunications, Computers, Military Electronics, Aerospace, Instrumentation, Medical Electronics, Industrial Electronics, Sensors and Consumer Electronics.