| 
Key Specifications
- OFHC Copper foil : 0.005” – 0.012” [127µm – 300µm]
- Substrate sizes up to 4” x 4” [100mm x 100mm]
- Standard substrate thicknesses of 0.15”, 0.20”, 0.25”, and 0.40”.
Custom thicknesses are also available
- Precision Lapped Substrates for improved camber and flatness control.
- Laser Scribed or Diamond Sawn Edges
- Laser Drilled or Ultrasonically drilled Holes
- Patterning to 10 mil lines and spaces [250 µm]
- Precise front-side to back-side pattern alignments
|
Welcome to Globec (UK), your specialist distributor for EMC Suppression
and Hybrid Microcircuit components!
Direct-bond Copper (DBCu) Substrates from Stellar Industries
Available in the UK through Globec (UK), Direct-Bond Copper Substrates
fabricated in the USA by Stellar Industries Inc.
Stellar Industries is a licensee of the GE patented Direct Bond Copper
(DBCu) process and offers fast turnaround of custom designed substrates
for both prototype and production requirements.
DBCu substrates provide excellent thermal management where high power
circuitry is necessary such as power supplies, motor switching and drive
controllers. The substrates handle substantially higher power levels than
conventional metalisation method. Standard substrate materials include
Aluminium Nitride (AlN) and Beryllium Oxide (BeO).
Features include :
- High thermal conductivity and electrical conductance
- Excellent adhesion for brazing, soldering or wire bonding
- High temperature (1000°C)
- Re-workable and plate able with nickel or gold
- Suitable for solid filled feed-through's
For More information please Contact us |
